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Method for compensating for tool processing variation in the routing of wafers/lots

机译:补偿晶片/批生产线中工具加工变化的方法

摘要

A method for increasing overall yield in semiconductor manufacturing including routing wafers or wafer lots from tool to tool in a manner which at least partially neutralizes or compensates for processing variations. A system for increasing overall yield in semiconductor manufacturing includes a module for recording processing data from plural first and second types of tools and a module for routing wafers or wafer lots from tools of the first type of tools to tools of the second type of tools so as to at least partially neutralizes or compensate for processing variation.
机译:一种用于提高半导体制造中的总产量的方法,该方法包括以至少部分中和或补偿工艺差异的方式在一个工具之间路由晶片或晶片批。一种用于在半导体制造中提高总产量的系统,包括用于记录来自多种第一和第二种工具的加工数据的模块,以及用于将晶片或晶片批次从第一类工具的工具路由到第二类工具的工具的模块,因此关于至少部分地抵消或补偿工艺变化。

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