首页> 外国专利> BENDING-TYPE RIGID PRINTED WIRING BOARD AND PROCESS FOR PRODUCING THE SAME

BENDING-TYPE RIGID PRINTED WIRING BOARD AND PROCESS FOR PRODUCING THE SAME

机译:弯曲型刚性印刷线路板及其制造方法

摘要

This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties), can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard core material (1) with a space part (1A) inserted thereinto. A heat-resistant resin layer (31) is stacked on the surface of the hard core material (1) and, at the same time, on the upper surface of the space part (1A). A heat-resistant resin layer (32) is stacked on the backside of the core material (1) except for the space part (1A). Further, a conductor layer (4) is stacked and fixed through the heat-resistant resin layers (31, 32). The conductor layer (4) has been etched to form a circuit.
机译:本发明提供了一种弯曲型刚性印刷线路板,其可以容易地实现电气部件的安装(可以实现具有高生产率和组装特性的电镀电路),可以实现节省空间并且可以实现容易的生产。弯曲型刚性印刷线路板包括其中插入有空间部分(1A)的硬芯材料(1)。耐热树脂层(31)层叠在硬质芯材(1)的表面上,并且同时层叠在空间部(1A)的上表面上。在芯材(1)的背面,除了空间部(1A)以外,还层叠有耐热性树脂层(32)。此外,导体层(4)通过耐热树脂层(31、32)堆叠并固定。导体层(4)已经被蚀刻以形成电路。

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