ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD

摘要

This adhesive composition contains a block copolymer, and an adhesive layer formed using the same has a Young's modulus at 23°C of 0.1 GPa or greater, a storage elastic modulus (G') at 220°C of 1.5×10⁵ Pa or lower, and a loss factor (tanσ) at 220°C of 1.3 or lower.