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METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BONDING ON PRINTED CIRCUIT BOARDS AND IC-SUBSTRATES
METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BONDING ON PRINTED CIRCUIT BOARDS AND IC-SUBSTRATES
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机译:在印刷电路板和IC基板上获得用于铜线键合的钯表面处理的方法
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摘要
The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
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