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Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
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机译：在印刷电路板和ic基板上获得用于铜线键合的钯表面处理的方法
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摘要
The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
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