首页> 外国专利> WINDOW-INTEGRATED TOUCH SCREEN PANEL HAVING AN IMPROVED CONDUCTIVE CIRCUIT WIRE, ELIMINATING A DEPOSITION PROCESS FOR FORMING THE CONDUCTIVE CIRCUIT WIRE

WINDOW-INTEGRATED TOUCH SCREEN PANEL HAVING AN IMPROVED CONDUCTIVE CIRCUIT WIRE, ELIMINATING A DEPOSITION PROCESS FOR FORMING THE CONDUCTIVE CIRCUIT WIRE

机译:具有改进的导电电路线的窗口集成触摸屏面板,消除了形成导电电路线的沉积过程

摘要

PURPOSE: A window-integrated touch screen panel having an improved conductive circuit wire is provided to minimize a fault factor such as disconnection or crack by connecting conductive circuit wires formed on an FPCB(Flexible Printed Circuit Board) to a conductive layer.;CONSTITUTION: A window-integrated TSP(Touch Screen Panel) includes a panel layer including a window substrate(10) and a first ITO(Indium Tin Oxide) layer(21) and an FPCB(Flexible Printed Circuit Board)(30) connected to the first ITO layer. The FPCB includes a conductive circuit wire in a connection unit. The connection unit is formed by extending both ends of the panel layer in a longitudinal direction of the TSP. A first insulation layer(41) is equipped in the bottom of the first ITO layer.;COPYRIGHT KIPO 2013;[Reference numerals] (21) First ITO layer; (41) First insulation layer
机译:目的:提供一种具有改进的导电线路的窗口集成触摸屏面板,通过将形成在FPCB(柔性印刷电路板)上的导电线路连接到导电层上,以最大程度地减少诸如断线或破裂等故障因素。窗口集成的TSP(触摸屏面板)包括:面板层,其包括窗口基板(10)和第一ITO(氧化铟锡)层(21);以及连接至第一面板的FPCB(柔性印刷电路板)(30) ITO层。 FPCB在连接单元中包括导电电路线。通过在TSP的纵向方向上延伸面板层的两端来形成连接单元。第一绝缘层(41)被装备在第一ITO层的底部。COPYRIGHT KIPO 2013; [附图标记](21)第一ITO层; (41)第一绝缘层

著录项

  • 公开/公告号KR20130002123A

    专利类型

  • 公开/公告日2013-01-07

    原文格式PDF

  • 申请/专利权人 MOREENS. CO. LTD.;

    申请/专利号KR20110063175

  • 发明设计人 JU JEONG HUN;

    申请日2011-06-28

  • 分类号G06F3/041;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:56

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