首页> 外国专利> METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE MANUFACTURED BY THE SAME CAPABLE OF PROCESSING POLYSILICON MATERIALS WITH A SILICIDE PROCESS

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE MANUFACTURED BY THE SAME CAPABLE OF PROCESSING POLYSILICON MATERIALS WITH A SILICIDE PROCESS

机译:制造半导体器件的方法和由具有硅化物工艺的多晶硅材料的相同制造能力制造的半导体器件

摘要

PURPOSE: A method for manufacturing a semiconductor device and the semiconductor device manufactured by the same are provided to prevent a polysilicon resister from being damaged by protecting the polysilicon register in a replacement metal gate process.;CONSTITUTION: A gate oxide layer(150) is deposited on a substrate. A first polysilicon layer(152) is formed on the gate oxide layer. A photoresist layer is formed on the substrate including the gate oxide layer and a first polysilicon layer. A recess region(113) is formed in a third STI region by etching the exposed region of the first polysilicon layer and the gate oxide layer. A second polysilicon layer(152a) is formed on the substrate including the first polysilicon layer. A part(152b) of the second polysilicon layer is formed in the recess region.;COPYRIGHT KIPO 2013
机译:目的:提供一种半导体器件的制造方法和由该半导体器件制造的半导体器件,以通过在替代金属栅极工艺中保护多晶硅寄存器来防止多晶硅电阻器损坏。组成:栅极氧化层(150)是沉积在基板上。在栅极氧化物层上形成第一多晶硅层(152)。在包括栅极氧化物层和第一多晶硅层的基板上形成光刻胶层。通过蚀刻第一多晶硅层和栅氧化层的暴露区域在第三STI区域中形成凹陷区域(113)。在包括第一多晶硅层的衬底上形成第二多晶硅层(152a)。在凹陷区域中形成第二多晶硅层的一部分(152b)。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130009572A

    专利类型

  • 公开/公告日2013-01-23

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20110146151

  • 发明设计人 KIM JE DON;KIM JU YOUN;

    申请日2011-12-29

  • 分类号H01L21/336;H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:49

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