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METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE MANUFACTURED BY THE SAME CAPABLE OF PROCESSING POLYSILICON MATERIALS WITH A SILICIDE PROCESS
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE MANUFACTURED BY THE SAME CAPABLE OF PROCESSING POLYSILICON MATERIALS WITH A SILICIDE PROCESS
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机译:制造半导体器件的方法和由具有硅化物工艺的多晶硅材料的相同制造能力制造的半导体器件
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摘要
PURPOSE: A method for manufacturing a semiconductor device and the semiconductor device manufactured by the same are provided to prevent a polysilicon resister from being damaged by protecting the polysilicon register in a replacement metal gate process.;CONSTITUTION: A gate oxide layer(150) is deposited on a substrate. A first polysilicon layer(152) is formed on the gate oxide layer. A photoresist layer is formed on the substrate including the gate oxide layer and a first polysilicon layer. A recess region(113) is formed in a third STI region by etching the exposed region of the first polysilicon layer and the gate oxide layer. A second polysilicon layer(152a) is formed on the substrate including the first polysilicon layer. A part(152b) of the second polysilicon layer is formed in the recess region.;COPYRIGHT KIPO 2013
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