首页> 外国专利> ATOMIC LAYER ETCHING METHOD OF GRAPHENE CAPABLE OF PARTLY ETCHING GRAPHENE INCLUDING THE THIN FILM OF OVERLAPPED MULTI-LAYER GRAPHENE WHILE MINIMIZING PHYSICAL AND ELECTRICAL DAMAGE

ATOMIC LAYER ETCHING METHOD OF GRAPHENE CAPABLE OF PARTLY ETCHING GRAPHENE INCLUDING THE THIN FILM OF OVERLAPPED MULTI-LAYER GRAPHENE WHILE MINIMIZING PHYSICAL AND ELECTRICAL DAMAGE

机译:最小化物理和电气损伤时能覆盖部分石墨烯的石墨烯原子层刻蚀方法,包括重叠的多层石墨烯的薄膜

摘要

PURPOSE: An atomic layer etching method is provided to control graphene etching with an atom as a unit, to selectively control the etching depth of graphene, to be processed uncomplicatedly, and to be commercialized.;CONSTITUTION: An atomic layer etching method includes the following steps: absorbing a reactive radical on the surface of graphene; irradiating an energy source in graphene absorbed in the reactive radical; the two steps are repeated over two times; the graphene includes the thin film of overlapped multi-layer graphene; a singular layer of the thin film of graphene is etched by performing the atomic layer etching method one time; the reactive radical is generated with plasma.;COPYRIGHT KIPO 2013
机译:目的:提供一种原子层刻蚀方法,以原子为单位控制石墨烯刻蚀,选择性地控制石墨烯的刻蚀深度,使其加工简单化,并实现商品化。步骤:吸收石墨烯表面的反应性自由基。在吸收了活性基团的石墨烯中照射能量源;这两个步骤重复两次;所述石墨烯包括重叠的多层石墨烯的薄膜。通过一次执行原子层刻蚀方法刻蚀石墨烯薄膜的奇异层;反应性自由基由等离子体产生。; COPYRIGHT KIPO 2013

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