首页>
外国专利>
ATOMIC LAYER ETCHING METHOD OF GRAPHENE CAPABLE OF PARTLY ETCHING GRAPHENE INCLUDING THE THIN FILM OF OVERLAPPED MULTI-LAYER GRAPHENE WHILE MINIMIZING PHYSICAL AND ELECTRICAL DAMAGE
ATOMIC LAYER ETCHING METHOD OF GRAPHENE CAPABLE OF PARTLY ETCHING GRAPHENE INCLUDING THE THIN FILM OF OVERLAPPED MULTI-LAYER GRAPHENE WHILE MINIMIZING PHYSICAL AND ELECTRICAL DAMAGE
展开▼
机译:最小化物理和电气损伤时能覆盖部分石墨烯的石墨烯原子层刻蚀方法,包括重叠的多层石墨烯的薄膜
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: An atomic layer etching method is provided to control graphene etching with an atom as a unit, to selectively control the etching depth of graphene, to be processed uncomplicatedly, and to be commercialized.;CONSTITUTION: An atomic layer etching method includes the following steps: absorbing a reactive radical on the surface of graphene; irradiating an energy source in graphene absorbed in the reactive radical; the two steps are repeated over two times; the graphene includes the thin film of overlapped multi-layer graphene; a singular layer of the thin film of graphene is etched by performing the atomic layer etching method one time; the reactive radical is generated with plasma.;COPYRIGHT KIPO 2013
展开▼