首页>
外国专利>
PRINTED CIRCUIT BOARD FACILITATING THE REDUCTION OF PROCESS COSTS BY REDUCING SOLDER USAGE, AND A MANUFACTURING METHOD THEREOF
PRINTED CIRCUIT BOARD FACILITATING THE REDUCTION OF PROCESS COSTS BY REDUCING SOLDER USAGE, AND A MANUFACTURING METHOD THEREOF
展开▼
机译:印刷电路板,其通过减少焊锡的使用量来减少工艺成本,并提供了一种制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve wetting between solder and a surface-treated layer and to reduce bump defects by forming a copper layer through electroplating on a bump pad when forming a fine pitch bump.;CONSTITUTION: A printed circuit board(100) includes a base substrate(110), a circuit layer, a solder resist layer(130), a metal layer(140), and a surface-treated layer(150). The solder resist layer functions as a protection layer for the outermost layer circuit and is formed for electrical insulation. The metal layer is formed at an open part(131) of the solder resist layer and reduces an aspect ratio by filling the space of the open part.;COPYRIGHT KIPO 2013
展开▼