Gigahertz shielding at printed circuit board level - eliminate or reduce enclosure shielding costs

摘要

Shielding at the enclosure level is unable to deal with the increasing problems of interference between devices within the products due to the continuous shrinking of the silicon feature sizes in integrated circuits and the increase in packing density of modern surface-mounted printed circuit board assemblies. PCB level shielding is capable of dealing with these problems of internal interference and regulatory emissions control at a low cost. This paper discussed the importance of shielding as well as the different types of PCB shielding cans. The paper also gave an overview of PCB shielding materials, PCB shield apertures, and cavity resonances.