SOLDERING METHOD FOR CAMERA MODULE FOR IMPROVING AN ELECTRICAL CONTACT BETWEEN AN ACTUATOR SUBSTRATE AND A MODULE SUBSTRATE AND EXTERNAL ELECTRICAL CONNECTIVITY

摘要

PURPOSE: A soldering method for camera module is provided to solder a module substrate onto an actuator substrate at the same time soldering the module substrate onto a main substrate, thereby simplifying the soldering process of the camera module and reducing the process time.;CONSTITUTION: A camera module comprises a housing, a module substrate (120), and an actuator substrate (110). Solder (130) is dispensed between a connection terminal (111) of the actuator substrate and a connection pad of the module substrate. The connection pad and the connection terminal are soldered while the module substrate is soldered onto a main substrate of an external electronic component through a hot bar process. The solder is the low-temperature solder of a cream type.;COPYRIGHT KIPO 2013