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INTEGRATED CIRCUIT DEVICE CAPABLE OF PREVENTING THE WARPAGE OF A BASE BY CHANGING THE THICKNESS OF THE BASE AND A WARPAGE CONTROLLING METHOD
INTEGRATED CIRCUIT DEVICE CAPABLE OF PREVENTING THE WARPAGE OF A BASE BY CHANGING THE THICKNESS OF THE BASE AND A WARPAGE CONTROLLING METHOD
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机译:能够通过改变基板的厚度来防止基板的翘曲的综合电路装置及翘曲控制方法
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摘要
PURPOSE: An integrated circuit device and a warpage controlling method are provided to flatten a surface for attaching the integrated circuit device to a heat sink by preventing the warpage of a base.;CONSTITUTION: At least one die (502,504) is attached to a base (506). A counterbalancing layer (508) compensates for a part of a thermal expansion difference between the base and the die. The counterbalancing layer is deposited on one side of the base. The thickness of the counterbalancing layer is 5 to 100 micrometers.;COPYRIGHT KIPO 2013
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