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FABRICATION METHOD OF MOISTURE BARRIER LAYER WITH INORGANIC LAYERS, MOISTURE BARRIER LAYER WITH INORGANIC LAYERS AND ELECTRIC, ELECTRONIC ENCAPSULATION DEVICE
FABRICATION METHOD OF MOISTURE BARRIER LAYER WITH INORGANIC LAYERS, MOISTURE BARRIER LAYER WITH INORGANIC LAYERS AND ELECTRIC, ELECTRONIC ENCAPSULATION DEVICE
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机译:具有无机层的防潮层,具有无机层的防潮层和电气电子包封装置的制造方法
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摘要
PURPOSE: A method for manufacturing a moisture penetration-preventing film using an inorganic film, a moisture penetration-preventing film using an organic film, and an electron bag device prevent the penetration of moisture, and absorb the moisture in an element, preventing the degradation of electric elements. CONSTITUTION: A moisture penetration-preventing film (100) comprises a substrate (110), an alternately laminated inorganic film (120) of the amorphous state, and another inorganic film (130) of the amorphous state. The moisture penetration-preventing film successively repeats a first cycle and a second cycle multiple times. The first cycle and the second cycle are performed with the atomic layer deposition mode. The thickness of a film layered for the first cycle is from 0.8 to 1.4 inclusively. The thickness of a film layered for the second cycle is from 0.6 to 1.2 inclusively.
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