首页> 外国专利> FABRICATION METHOD OF MOISTURE BARRIER LAYER WITH INORGANIC LAYERS, MOISTURE BARRIER LAYER WITH INORGANIC LAYERS AND ELECTRIC, ELECTRONIC ENCAPSULATION DEVICE

FABRICATION METHOD OF MOISTURE BARRIER LAYER WITH INORGANIC LAYERS, MOISTURE BARRIER LAYER WITH INORGANIC LAYERS AND ELECTRIC, ELECTRONIC ENCAPSULATION DEVICE

机译:具有无机层的防潮层,具有无机层的防潮层和电气电子包封装置的制造方法

摘要

PURPOSE: A method for manufacturing a moisture penetration-preventing film using an inorganic film, a moisture penetration-preventing film using an organic film, and an electron bag device prevent the penetration of moisture, and absorb the moisture in an element, preventing the degradation of electric elements. CONSTITUTION: A moisture penetration-preventing film (100) comprises a substrate (110), an alternately laminated inorganic film (120) of the amorphous state, and another inorganic film (130) of the amorphous state. The moisture penetration-preventing film successively repeats a first cycle and a second cycle multiple times. The first cycle and the second cycle are performed with the atomic layer deposition mode. The thickness of a film layered for the first cycle is from 0.8 to 1.4 inclusively. The thickness of a film layered for the second cycle is from 0.6 to 1.2 inclusively.
机译:用途:使用无机膜制造防潮膜的方法,使用有机膜的防潮膜和电子袋装置可防止水分渗透并吸收元件中的水分,从而防止降解电气元件。构成:防潮膜(100)包括基板(110),交替层叠的非晶态无机膜(120)和另一种非晶态无机膜(130)。防潮膜连续多次重复第一循环和第二循环。第一周期和第二周期以原子层沉积模式执行。在第一循环中成膜的膜的厚度为0.8至1.4(包括端值)。在第二循环中成膜的膜的厚度为0.6至1.2(包括端点)。

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