首页> 美国政府科技报告 >Inorganic Substrates and Encapsulation Layers for Transient Electronics
【24h】

Inorganic Substrates and Encapsulation Layers for Transient Electronics

机译:用于瞬态电子设备的无机基质和封装层

获取原文

摘要

The objective of this work was to establish a database of dissolution rates for various inorganic materials relevant to encapsulation layers and substrates for transient electronic systems, and to establish demonstration vehicles for the use of these materials in electronic devices with practical ranges of transient time. The scope of the work was to study the kinetics of dissolution in various solutions, to design and demonstrate an inorganic-based substrate system and encapsulation strategy, and to demonstrate functionality by the integration of simple transient electronic components onto these substrates with encapsulation.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号