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WAFER BONDING APPARATUS FOR BONDING LID GLASS TO WAFER
WAFER BONDING APPARATUS FOR BONDING LID GLASS TO WAFER
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机译:晶圆粘合玻璃的晶圆粘合装置
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摘要
PURPOSE: A wafer bonding apparatus for bonding a lid glass to a wafer is provided to reduce a thickness difference by uniformly maintaining a gap between a first bonding jig and a second bonding jig. CONSTITUTION: A first bonding jig(200) mounts a wafer or a lid glass. A second bonding jig(300) faces the first bonding jig. A gap determination member controls a gap between the first bonding jig and the second bonding jig. A press module(400) pressurizes the second bonding jig toward the first bonding jig. A gap accommodating grooves are opened toward a second jig body.
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