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MULTI-CHIP MODULE (MCM) POWER QUAD FLAT NO-LEAD (PQFN) SEMICONDUCTOR PACKAGE UTILIZING A LEADFRAME FOR ELECTRICAL INTERCONNECTIONS
MULTI-CHIP MODULE (MCM) POWER QUAD FLAT NO-LEAD (PQFN) SEMICONDUCTOR PACKAGE UTILIZING A LEADFRAME FOR ELECTRICAL INTERCONNECTIONS
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机译:多芯片模块(MCM)电力四方扁平无铅(PQFN)半导体封装,利用引线框架进行电气互连
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摘要
Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One exemplary embodiment comprises a PQFN semiconductor package comprising a leadframe, a driver integrated circuit (IC) coupled to the leadframe, a plurality of vertical conduction power devices coupled to the leadframe, and a plurality of wirebonds providing electrical interconnects, including at least one wirebond from a top surface electrode of one of the plurality of vertical conduction power devices to a portion of the leadframe, wherein the portion of the leadframe is electrically connected to a bottom surface electrode of another of the plurality of vertical conduction power devices. In this manner, efficient multi-chip circuit interconnections can be provided in a PQFN package using low cost leadframes.
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