MULTI-CHIP MODULE (MCM) POWER QUAD FLAT NO-LEAD (PQFN) SEMICONDUCTOR PACKAGE UTILIZING LEADFRAME FOR ELECTRICAL INTERCONNECTIONS

摘要

PROBLEM TO BE SOLVED: To provide a unique, cost-effective and reliable solution to support the efficient design and operation of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package.SOLUTION: A power quad flat no-lead (PQFN) semiconductor package includes: a leadframe 160; a driver integrated circuit (IC) 130 coupled to the leadframe; a plurality of vertical conduction power devices 140a to 140f coupled to the leadframe; and a plurality of wirebonds providing electrical interconnections. The plurality of wirebonds include at least one wirebond from a top surface electrode of one of the plurality of vertical conduction power devices to a portion of the leadframe. A portion of the leadframe is electrically connected to a bottom surface electrode of another of the plurality of vertical conduction power devices. In this manner, efficient multi-chip circuit interconnections can be provided in a PQFN package using a low-cost leadframe.