EUTECTIC DIE BONDING APPARATUS, SYSTEM AND BONDING EUTECTIC PERFORM METHOD USING THEREOF

摘要

eutectic die adhesive device, discloses a system and a eutectic bonding process is carried out using the same method. The eutectic die-adhesive system comprising a substrate inside a closed chamber; Is provided in the hermetic chamber, LED die eutectic layer is formed on the back; Inductively-coupled with the heating device, the LED die to generate a magnetic field on the back of heating the eutectic layer over an eddy current on the LED die rear eutectic die adhesive devices; The hermetic chamber, comprising jeeobueul for controlling the operation of the LED die and eutectic die-adhesive device, the adhesive device is a eutectic eutectic die die collet high-frequency oscillator is coupled; Eutectic die collet first insulating film formed on the outer surface; Gene induction coil wound around the circumference of the first insulating film; A second insulating film formed on the first insulating layer around the said induction coil is wound; The eutectic die and includes a thermocouple (thermocouple) sensor formed on the second insulating film in the same longitudinal direction and the collet. ;