Integrated circuit chip with a stress buffering layer, semiconductor device, method for protecting a chip and single chip device

摘要

An integrated circuit chip configured to be mounted on a carrier, the integrated circuit chip comprising: a first surface configured to be mounted on the carrier; an active area of the integrated circuit chip spaced from the first surface; a bondpad disposed over the active area and in electrical communication therewith; and a ceramic inorganic stress buffering layer disposed between the active region and the bonding pad, wherein the stress buffering layer comprises nitrides of one of Group 4-6 of the Periodic Table of Elements, borides of one of Groups 4-6 or carbides of one of the groups 4-6 covers.