The present invention is a copper alloy sheet of the Cu-Fe-P system comprising Fe: 0.02 to 0.5% and P: 0.01 to 0.25%, in mass%, with the remainder being copper and unavoidable impurities, and wherein the Fe / P ratio of Fe to P, in mass%, is 2.0 to 5.0, wherein the ratio of the area of fine crystal grains having a circle equivalent diameter of less than 0.5 μm An examination area when a surface is examined by EBSD analysis is 0.90 or less, and the ratio C1s / Cu2p of the peak area of C1s to the peak area of Cu2p on the surface is 0.35 or less according to an XPS analysis ,
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机译：本发明是Cu-Fe-P系的铜合金薄板，其以质量％计含有Fe：0.02〜0.5％，P：0.01〜0.25％，其余为铜和不可避免的杂质，其中，Fe / P Fe / P的质量比为2.0〜5.0，其中，圆当量直径小于0.5μm的微细晶粒的面积比通过EBSD分析检查表面时的检查面积为0.90以下根据XPS分析，表面上C1s的峰面积与Cu2p的峰面积的比值C1s / Cu2p为0.35以下，
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