TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE

摘要

The cantilever bending test,particularly monitored by an acoustic emission technique,was adopted to measure the tensile and interfacial adhesive strengths of the HCD ionplated fine TiN film on pure Ti substrate.The behaviors of film damaging were foundto be characterized by:an internal tensile stress which exceeded its tensile strength forTiN facing upward,and a shearing stress along film substrate interface which exceededits adhesive strength for TiN facing downward.The measured tensile and adhcsivestrengths are 603 and 242 MPa respectively.