首页> 外国专利> Silicon carbide-barrier layer-schottky diode, has trenches provided in region of silicon carbide layer with depth and in distance so that electrical field intensity at schottky-transition-boundary surface is equal to specific value or small

Silicon carbide-barrier layer-schottky diode, has trenches provided in region of silicon carbide layer with depth and in distance so that electrical field intensity at schottky-transition-boundary surface is equal to specific value or small

机译:碳化硅阻挡层-肖特基二极管,在碳化硅层的区域中具有深度和距离的沟槽,使得在肖特基-过渡-边界表面处的电场强度等于或小于特定值

摘要

The diode has a silicon carbide layer including a region i.e. n -drift layer (2), of a conductive type with a dopant concentration that is smaller than a n +silicon carbide substrate (1), and another region i.e. part of side wall of trenches (7), of another conductive type designed in a semiconductor region (4) of a p-type. The trenches are provided in the latter region with a depth and in a distance (Lsbd) so that an electrical field intensity at a schottky-transition-boundary surface is equal to 0.1 megavolts per cm or small during applying a reverse voltage. The drift layer includes a surface with a defect density that is defined by etch pits, which are formed during etching with molten potassium hydroxide.
机译:该二极管具有碳化硅层,该碳化硅层包括导电类型的区域,即n->漂移层(2),其掺杂剂浓度小于+>碳化硅衬底(1),以及另一区域,即侧壁的一部分在p型半导体区域(4)中设计另一种导电类型的沟槽(7)。在后一区域中以一定深度和距离(Lsbd)提供沟槽,使得在施加反向电压期间,在肖特基转变边界表面处的电场强度等于或等于0.1兆伏/厘米。漂移层包括具有由蚀刻坑限定的缺陷密度的表面,该蚀刻坑是在用熔融氢氧化钾蚀刻期间形成的。

著录项

  • 公开/公告号DE102012023512A1

    专利类型

  • 公开/公告日2013-06-06

    原文格式PDF

  • 申请/专利权人 HITACHI LTD.;

    申请/专利号DE20121023512

  • 申请日2012-11-30

  • 分类号H01L29/861;H01L29/872;

  • 国家 DE

  • 入库时间 2022-08-21 16:21:53

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