Packaging integrated circuit by fabricating package module from successive build-up layers having circuit interconnections, and forming cavity on top-side of package module

摘要

An integrated circuit (IC) is packaged by fabricating a package module from successive build-up layers having circuit interconnections; forming a cavity on a top-side of package module; attaching a metallized back-side of a chip having front-side with a forward contact onto a metallic layer; disposing the chip in cavity such that forward contact is connected to the circuit interconnections of package module; and coupling the metallic layer that is attached to the chip onto the top-side of the package module. An independent claim is included for an IC package.