首页> 外国专利> Multi-layer printed circuit structure for antenna of airborne radar, has layer whose metalized face is provided with electronic component, where metalized faces of layer are assembled with metalized faces of another layer

Multi-layer printed circuit structure for antenna of airborne radar, has layer whose metalized face is provided with electronic component, where metalized faces of layer are assembled with metalized faces of another layer

机译:机载雷达天线的多层印刷电路结构,其层的金属化面装有电子元件,其中该层的金属化面与另一层的金属化面组装在一起

摘要

The structure has a layer (CM1a) including first and second machined metalized faces. Another layer (CM2) comprises first and second machined metalized faces, where the first metalized face of the latter layer is provided with an electronic component. The metalized faces of the former layer are assembled with the metalized faces of the latter layer. The latter layer includes a track made of copper. The layers are attached with each other. Subsets (SE3a, SE3b) are metalized on the first or second metalized faces of the former layer. An independent claim is also included for a method for realizing a multi-layer printed circuit structure.
机译:该结构具有包括第一和第二机加工金属化面的层(CM1a)。另一层(CM2)包括第一和第二机加工金属化面,其中后一层的第一金属化面设有电子元件。前一层的金属化面与后一层的金属化面组装在一起。后者包括由铜制成的轨道。各层相互连接。子集(SE3a,SE3b)在前一层的第一或第二金属化面上金属化。还包括用于实现多层印刷电路结构的方法的独立权利要求。

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