HIGH THERMAL CONDUCTIVITY PREPREG, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD USING PREPREG, AND SEMICONDUCTOR DEVICE USING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To prepare a prepreg having high thermal conductivity and a low thermal expansion coefficient.;SOLUTION: A prepreg comprises a composite layer including: an alumina-containing cloth containing ceramic fibers; and a thermosetting resin composition impregnated into the alumina-containing cloth and having a thermal conductivity coefficient greater than or equal to 1.0 W/(m K). In a prepreg, the ceramic fibers contain at least 99 mass% of alumina. In a prepreg, the crystal structure of the alumina of the ceramic fibers is the α type. In a prepreg, the thermal conductivity coefficient of the thermosetting resin composition is greater than or equal to 2.0 W/(m K).;COPYRIGHT: (C)2014,JPO&INPIT