SEALING MATERIAL WITH SUPPORT BASE MATERIAL, SUBSTRATE HAVING SEALED SEMICONDUCTOR ELEMENT MOUNTED THEREON, WAFER HAVING SEALED SEMICONDUCTOR ELEMENT FORMED THEREON, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sealing material with a support base material capable of reducing warp, preventing failure in filling, and manufacturing a semiconductor device excellent in heat resistance properties and moisture resistance properties, without taking measures to avert substrates and wafers from warping due to fillers and adjusting a filling amount of resin according to the number of defective elements during forming a sealing layer in a conventional manner, and to provide a substrate having a sealed semiconductor element mounted thereon using the sealing material with the support base material, a wafer having a sealed semiconductor element formed theron, a semiconductor device manufactured using these, and a method for manufacturing the semiconductor device.;SOLUTION: There is provided a sealing material that collectively seals a semiconductor element mounting surface of a substrate on which a semiconductor element is mounted, or a semiconductor element forming surface of a wafer on which a semiconductor element is formed. In the sealing material with a sealed semiconductor element, in which a support base material and a thermosetting resin layer are laminated, a difference in expansion coefficient between the substrate and the wafer is equal to or less than 5 ppm, and the thermosetting resin layer has a shape having a difference in height in a thickness direction.;COPYRIGHT: (C)2014,JPO&INPIT