SEALING MATERIAL WITH SUPPORT BASE MATERIAL, SEALED SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR ELEMENT FORMATION WAFER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sealing material with a support base material that can suppress warpage of a substrate or a wafer and peel-off of a semiconductor element even in a case where a large-diameter wafer or a large-area substrate is sealed, and that can seal a semiconductor element mounting surface of the substrate or a semiconductor element formation surface of the wafer as a block, and that achieves uniformity and homogeneity by eliminating openings and twists in fibers, and that has an excellent reliability in heat resistance, electrical insulation property, humidity resistance, and the like, and that has very excellent versatility, mass productivity, and economical efficiency.;SOLUTION: Provided is a sealing material with a support base material for sealing a semiconductor element mounting surface of a substrate or a semiconductor element formation surface of a wafer, as a block. The sealing material has: a support base material including a fiber film whose surface is processed by an organic silicon compound; and a resin layer formed on one surface of the support base material and formed of a thermoset resin.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2016,JPO&INPIT