WIRING DEFECT INSPECTION DEVICE, WIRING DEFECT INSPECTION METHOD, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To efficiently classifying multiple short circuit parts.SOLUTION: A wiring defect inspection device 100 includes a main control unit (application pattern determination means) 7 for determining application patterns to allow the number of application patterns required for specifying the kinds of short circuit parts on the basis of presence/absence of heat generation for each application pattern to be smaller than the number of the kinds of short circuit parts when classifying short circuit parts on the basis of the heat generation states of short circuit parts where heat generation has occurred by the application of a voltage.