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METHOD FOR DIVIDING CERAMIC SUBSTRATE, AND SCRIBING DEVICE
METHOD FOR DIVIDING CERAMIC SUBSTRATE, AND SCRIBING DEVICE
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机译:陶瓷基板的分割方法及划片装置
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摘要
PROBLEM TO BE SOLVED: To divide a ceramic substrate only by a scribing device.SOLUTION: A scribe line is formed under first load by using a first scribing wheel 25. Then, scribing is performed along the scribe line under second load greater than the first load by using a second scribing wheel 27. This manner allows a vertical crack to proceed deep. Thus, a ceramic substrate 30 can be divided by performing the scribing two times by using only a scribing device.
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