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METHOD FOR DIVIDING CERAMIC SUBSTRATE, AND SCRIBING DEVICE

机译:陶瓷基板的分割方法及划片装置

摘要

PROBLEM TO BE SOLVED: To divide a ceramic substrate only by a scribing device.SOLUTION: A scribe line is formed under first load by using a first scribing wheel 25. Then, scribing is performed along the scribe line under second load greater than the first load by using a second scribing wheel 27. This manner allows a vertical crack to proceed deep. Thus, a ceramic substrate 30 can be divided by performing the scribing two times by using only a scribing device.
机译:解决的问题:仅用划线装置分割陶瓷基板。解决方案:使用第一划线轮25在第一载荷下形成划线。然后,在大于第一载荷的第二载荷下沿划线进行划线。通过使用第二划线轮27来承受最大载荷。这种方式允许垂直裂纹深入。因此,通过仅使用划线装置进行两次划线就可以分割陶瓷基板30。

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