Method of manufacturing a multi-channel communication path computer system and stacked die including microelectronic die, the die and the die, as well as how to allow electrical communication between the components of the stacked die package

摘要

(120,720), and (110,710), the second surface of the first surface, a microelectronic device having a (130,730) passage extending to said second surface from said first surface. Said passage comprises (131,132,231,232) conducting a plurality of channels that are separated from each other by (133,1133) insulating material.