SUBSTRATE BREAKING SPLITTING DEVICE AND SUBSTRATE BREAKING AND SPLITTING METHOD

摘要

PROBLEM TO BE SOLVED: To improve quality of the split section of a substrate W by applying bending moment of an optimal size and tensile stress to the broken and split part Wa of the substrate W according to characteristics of the substrate W.;SOLUTION: Immediately before or at the moment when a break bar 59 is brought into contact with a broken and split part Wa of a substrate W, the moving direction of a breaking and splitting head 49 is changed from a vertical lower direction to an oblique lower direction for separation from a table 3, and the breaking and splitting head 49 is moved obliquely downward by driving of a lifting power servo cylinder 43 and a horizontal movement power servo cylinder 53 to apply bending moment and tensile stress to the broken and split part Wa of the substrate W.;COPYRIGHT: (C)2014,JPO&INPIT