Semiconductor device and manufacturing method can be developed with alkali negative type photosensitive resin composition, curing relief pattern

摘要

PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition that is free from a problem of metal corrosion as the composition does not generate an acid during thermosetting, and to provide a production method of a cured relief pattern and a semiconductor device.;SOLUTION: The negative photosensitive resin composition contains 100 parts by mass of a polyhydroxyamide having a specified structure including a dihydroxy diamide unit and an optional diamide unit, 2 to 30 parts by mass of a vinylsulfone compound having a specified structure, and 3 to 30 parts by mass of a photo-base generator.;COPYRIGHT: (C)2011,JPO&INPIT