Negative type photosensitive resin composition , cured relief pattern formation and manufacturing method , and semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has excellent storage stability and can give a cured relief pattern with high sensitivity and high resolution on copper or copper alloy, as a useful coating for the production of an electric/electronic material.;SOLUTION: The negative photosensitive resin composition includes: (A) 100 pts.mass of a polyimide precursor; (B) 1-20 pts.mass of a photopolymerization initiator; and (C) 0.1-30 pts.mass of at least one compound or its polymerized compound, selected from a group consisting of a urea compound or its polymerized compound and a compound expressed by general formula (4) or its polymerized compound.;COPYRIGHT: (C)2011,JPO&INPIT