RIGID FLEXIBLE CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND RIGID FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a rigid flexible circuit substrate and a method of manufacturing the same, and a rigid flexible circuit board and a method of manufacturing the same.;SOLUTION: A rigid flexible circuit substrate of the present invention includes a flexible circuit substrate having an exposure region and a press region connected to the exposure region, a first laminating adhesive sheet connected to the press region, a second laminating adhesive sheet and a third laminating adhesive sheet positioned on both sides of the first laminating adhesive sheet and press region, and a third conductive circuit layer and a fourth conductive circuit layer formed on surfaces of the second laminating adhesive sheet and third laminating adhesive sheet, respectively. The first laminating adhesive sheet, second laminating adhesive sheet, and third laminating adhesive sheet all have an electric connection body formed, and a conductive circuit layer of the flexible circuit substrate is electrically connected to the third conductive circuit layer and fourth conductive circuit layer by the electric connection body. There are also disclosed a method of manufacturing the rigid flexible circuit substrate, and a rigid flexible circuit board and a method of manufacturing the same.;COPYRIGHT: (C)2014,JPO&INPIT