Bi-Sb-BASED Pb-FREE SOLDER ALLOY

摘要

PROBLEM TO BE SOLVED: To provide a Bi-Sb-based Pb-free solder alloy having a melting point exceeding 265°C, materially withstanding a reflow temperature of about 270°C, and having excellent processability.;SOLUTION: A Bi-Sb-based Pb-free solder alloy contains: Bi as a main component; Sb by 0.1-9.0 mass%; and at least one kind among Ag, Al, Zn, Sn, and Cu. When Ag is contained, its content is 0.01-4.00 mass%, and similarly for the rest, an Al content is 0.01-1.50 mass%, a Zn content is 0.1-5.0 mass%, a Sn content is 0.01-3.50 mass%, and a Cu content is 0.01-2.00 mass%.;COPYRIGHT: (C)2014,JPO&INPIT