The photosensitive resin composition, and a photosensitive element using the same, a resist pattern manufacturing method of the forming method and printed wiring board

摘要

The present invention, there is provided a photosensitive resin composition containing binder polymer (A), (B) a photopolymerizable compound and (C) a photopolymerization initiator, (A) binder polymer, the (meth) acrylic acid a structural unit derived, and a structural unit derived from (meth) acrylic acid benzyl ester derivative or (meth) acrylic acid benzyl ester, the compound is (B) a photopolymerizable compound, represented by the following general formula (1) relates to a photosensitive resin composition comprising a. Represents a hydrogen atom or a methyl group independently, an integer of 1 to 48 each independently, a, equation ^{(1), R 3} and 1, ^{R 2 R} is a and c b a, b and c The total number is 6-50. [Formula 1]