Adhesive for bonding electronic components and electronic parts bonding method.

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for electronic component adhesion, capable of shortening production tact time and extending pot life of the adhesive, and an electronic component adhesion method.;SOLUTION: The adhesive 3 for electronic component adhesion is used for the electronic component adhesion subjecting a flexible substrate 6 to thermocompression bonding to a rigid substrate 1, comprises a thermosetting resin including a main agent and a hardening agent, and includes hardened material particles 3b for which a hardened material of the thermosetting resin having the same functional group as the main agent is ground to particulates and solder particles 4 whose average particle diameter is larger than that of the hardened material particles 3b. Thus, a resin amount to be the object of thermosetting reaction in thermocompression bonding is reduced to allow the thermosetting resin 3a to be sufficiently hardened in a short time without the need of a highly reactive hardening agent, thereby shortening the production tact time and extending the pot life of the adhesive.;COPYRIGHT: (C)2012,JPO&INPIT