Semiconductor package terminal assignment method, semiconductor package terminal assignment support apparatus, semiconductor package, and program for executing semiconductor package terminal assignment method

摘要

An assignment method of terminals of a semiconductor package executed by an assignment supporting apparatus includes: deciding a maximum allowable distance to be a constraint condition regarding a relative distance between each of the pads and a terminal to be assigned to the pad, and extracting one or a plurality of assigned terminal candidates for each of the pads so that the relative distance between each of the pads and a terminal selected for the pad falls within a range of the maximum allowable distance; and deciding one of the terminals as a assigned terminal based on the assigned terminal candidates and assigning the one of the terminals to one of the pads. The process is a process to assign one of the terminals with priority to a pad having a smallest number of assigned terminal candidates in a not-assigned condition based on the assigned terminal candidates.