Semiconductor package terminal assignment method, semiconductor package terminal assignment support apparatus, semiconductor package, and program for executing semiconductor package terminal assignment method

摘要

A process of efficiently allocating any of the plurality of terminals of the package substrate on which the semiconductor chip is mounted to each of the plurality of pads of the semiconductor chip. When assigning one of multiple terminals on a package substrate to each of multiple pads on a semiconductor chip, the maximum allowable distance between each pad and the terminal to be assigned to each pad is restricted. One or more assigned terminals for each pad so that the relative distance between each of the pads and the terminal selected for each pad is within the range of the maximum allowable distance Extract candidates. Based on the extracted assignment terminal candidates, one of the terminals is determined as an assignment terminal and a process of assigning to one of the pads is performed. The process is a process of preferentially allocating one of the terminals to a pad that has a minimum number of allocated terminal candidates in an unallocated state and is one or more.