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The thick film silver paste which contains the copper and lead tellurium oxide and the use in producing the semiconductor device

机译:包含铜和碲化铅的厚膜银浆及其在制造半导体器件中的用途

摘要

PROBLEM TO BE SOLVED: To provide a thick film silver paste containing copper and lead-tellurium-oxide and its use in manufacture of semiconductor devices.;SOLUTION: The present invention is directed to a thick film silver paste comprising (i) silver, (ii) copper, and (iii) a Pb-Te-O all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste, and a semiconductor device and, in particular, a solar cell which comprise such an electrode. The electrodes provide good electrical performance.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种包含铜和氧化铅-碲的厚膜银浆及其在半导体器件制造中的用途。解决方案:本发明涉及一种包含(i)银,( ii)铜,和(iii)全部分散在有机介质中的Pb-Te-O。本发明还涉及由所述糊剂形成的电极,以及包括这种电极的半导体器件,特别是太阳能电池。电极具有良好的电性能。;版权所有:(C)2013,JPO&INPIT

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