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Image sensor package, the method of manufacturing the image pickup element package and electronics
Image sensor package, the method of manufacturing the image pickup element package and electronics
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机译:图像传感器封装,图像拾取元件封装的制造方法和电子设备
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摘要
An imaging device package includes: an imaging device chip; a substrate on which the imaging device chip is mounted; a wire that electrically connects the imaging device chip and the substrate at a peripheral edge of the substrate around the imaging device chip; a supporting body that supports an optical member with respect to the substrate; and a bonding section that bonds the supporting body to the substrate while sealing the wire and a bonding terminal of the wire at the peripheral edge of the substrate.
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