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A method of manufacturing an electro- tin plating solution and ceramic electronic components

机译:一种电镀锡溶液和陶瓷电子元件的制造方法

摘要

PROBLEM TO BE SOLVED: To provide an electrolytic tin plating solution that controls corrosion of a ceramic electronic component body, which is caused by plating, and achieves stable plating, and to provide a method for manufacturing a ceramic electronic component using the electrolytic tin plating solution.;SOLUTION: The electrolytic tin plating solution for the ceramic electronic component contains stannous ion and a chelating agent, and whose pH is controlled between 6-9, and whose value of the relation (molar concentration of the chelate agent)/(molar concentration of stannous ion) is controlled higher than 2.4 and 4.5 or less.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种电解镀锡溶液,其控制由镀覆引起的陶瓷电子部件主体的腐蚀并实现稳定的镀覆,并且提供一种使用该电解镀锡溶液制造陶瓷电子部件的方法。解决方案:用于陶瓷电子元件的电镀锡溶液包含亚锡离子和螯合剂,其pH值控制在6-9之间,并且其关系值(螯合剂的摩尔浓度)/(摩尔浓度) (亚锡离子含量)控制在2.4以上4.5以下。版权所有:(C)2012,日本特许厅&INPIT

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