Wiring board , electronic component embedded substrate , manufacturing method and manufacturing method of the electronic component built-in substrate of the wiring board

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable wiring board, printed circuit board with built-in electronic components, method of manufacturing a wiring board and method of manufacturing a printed circuit board with built-in electronic components by stabilizing interlayer connection.SOLUTION: The wiring board or the printed circuit board with built-in electronic components includes a printed circuit board having a resin containing multiple fillers, and vias for electrical connection with at least one interconnection provided on the printed circuit board. The via has a mixed region, where a metal is provided between multiple fillers, on the radial inside of the printed circuit board. The method of manufacturing a wiring board or a printed circuit board with built-in electronic components comprises the steps of: preparing a printed circuit board having a resin containing multiple fillers; forming a via formation hole in the printed circuit board; ashing at least the inner wall of the via formation hole; and electroless plating the inner wall of the via formation hole.