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Multiobjective Optimal Placement of Convectively Cooled Electronic Components on Printed Wiring Boards

机译：印刷线路板上对流冷却电子元件的多目标优化配置

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Nestor V. Queipo; Joseph A. C. Humphrey; Alfonso Ortega;
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年度 1998
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1. Multiobjective optimal placement of convectively cooled electronic components on printed wiring boards [J] . Queipo N.V., Humphrey J.A.C. IEEE transactions on components, packaging, and manufacturing technology. Part A . 1998,第1期

机译：对流冷却电子元器件在印刷线路板上的多目标优化布置
2. Optimal Package Design Of Stacks Of Convection-cooled Printed Circuit Boards Using Entropy Generation Minimization Method [J] . Wen, Jei Yang, Takahiro Furukawa, International Journal of Heat and Mass Transfer . 2008,第15a16期

机译：基于熵产生最小化的对流冷却印制电路板叠层最佳封装设计
3. Patent Issued for Capacitor-Incorporated Printed Wiring Board and Electronic Component [J] . Journal of Engineering . 2013,第12期

机译：电容器内置印刷线路板和电子零件的专利授权
4. MULTIOBJECTIVE OPTIMAL DESIGN OF PRINTED WIRING BOARDS WITH FORCED AIR COOLING [C] . Qishan Li, Olgierd A. Palusinski European Microelectronics Packaging Interconnection Symposium . 2002

机译：强制空气冷却印刷线板的多目标优化设计
5. Placement methods for electronic components on printed wiring boards based on reliability and routability measures. [D] . Osterman, Michael David. 1991

机译：基于可靠性和可布线性措施的电子元件在印刷线路板上的放置方法。
6. Highly Integrated Elastic Island-Structured Printed Circuit Board with Controlled Young’s Modulus for Stretchable Electronics [O] . Duho Cho, Junhyung Kim, Pyoenggeun Jeong, 2020

机译：高度可控的弹性岛结构印刷电路板具有可控制杨氏模量的可拉伸电子产品
7. Convective cooling and optimal placement of electronic components with variable ambient temperature I. The linear model [O] . Cahlon B., Schochetman I.E., Shillor M. 1993

机译：对流冷却和环境温度可变的电子元件的最佳放置I.线性模型
8. Implementing Cleaner Printed Wiring Board Technologies: Surface Finishes. Design for the Environment Printed Wiring Board Project. [R] . 2000

机译：实施更清洁的印刷线路板技术：表面处理。环境印刷线路板项目设计。

Multiobjective Optimal Placement of Convectively Cooled Electronic Components on Printed Wiring Boards

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