Being the substrate base material which is used inside the reaction chamber of the revised substrate temperature control null

摘要

Topic SolutionsThe substrate base material which is used inside the reaction chamber of the plasma central processing unit is disclosed. The substrate base material has with the conduction of heat component which is located on the based component and the based component. The conduction of heat component has had the multiple fields, each field of the conduction of heat component individually is heated and is cooled and. The electrostatic chuck is laid out on the conduction of heat component. The electrostatic chuck has the back face in order to support the substrate inside the reaction chamber of the plasma central processing unit. Cold liquid source and hot liquid source have communicated, the channel and the fluid of each field. Valve configuration in order to control the temperature of the liquid independently, inside the channel by adjusting the air-fuel ratio of the hot liquid and the cold liquid which wrap, is operation possible. With another execution configuration, the heating element which is laid out alongside the supply line and the transport line, before wrapping to the channel, heats the liquid from liquid source. Choice figure Drawing 6