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Package member assembly, method for manufacturing package member assembly, package member, and method for manufacturing piezoelectric vibration device using package member

机译:包装件组件,制造包装件组件的方法,包装件以及使用该包装件的压电振动装置的制造方法

摘要

[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.
机译:[解决手段]在包装构件组装体中,一体地形成有多个包装构件。所述包装构件组件包括:多个底孔,所述底孔设置在由玻璃制成的晶片的正面主表面和背面主表面上;以及外部端子,其连接至侧面导体,所述侧面导体附接到所述背面主板上的所述底孔的内壁面。面对。

著录项

  • 公开/公告号JP5482788B2

    专利类型

  • 公开/公告日2014-05-07

    原文格式PDF

  • 申请/专利权人 株式会社大真空;

    申请/专利号JP20110507301

  • 发明设计人 佐藤 俊介;幸田 直樹;吉岡 宏樹;

    申请日2010-04-02

  • 分类号H03H9/02;H03H3/02;H01L23/08;

  • 国家 JP

  • 入库时间 2022-08-21 16:11:49

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