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The temperature measurement method of the semiconductor substrate heat treatment apparatus and the semiconductor substrate heat treatment apparatus
The temperature measurement method of the semiconductor substrate heat treatment apparatus and the semiconductor substrate heat treatment apparatus
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机译:半导体衬底热处理设备的温度测量方法和半导体衬底热处理设备
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摘要
PROBLEM TO BE SOLVED: To provide a semiconductor substrate heat treatment apparatus which can detect a temperature of a horizontal surface of a stacked susceptor even when horizontal magnetic flux is provided to the susceptor.;SOLUTION: The heat treatment apparatus 10 indirectly heats a wafer 23 mounted on the susceptor 18. The heat treatment apparatus 10 includes an induction heating coil 26 arranged on an outer circumference side of the susceptor 18 and forming AC magnetic flux in a direction parallel to a heated object mounting surface of the susceptor 18, the susceptors 18 stacked in a plurality of stages vertically, an outer edge temperature sensor 47b for detecting a temperature of at least one outer edge part of the plurality of susceptors 18, and a central temperature sensor 47a for detecting at least one center part of the plurality of susceptors 18. The central temperature sensor 47a is a radiation thermometer. The susceptor 18 arranged adjacently above the susceptor 18 to be detected by the central temperature sensor 47a includes a reflection plate 19a for reflecting a detection wave from the radiation thermometer to a side of the susceptor 18 positioned below.;COPYRIGHT: (C)2012,JPO&INPIT
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