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SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT STRUCTURE
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT STRUCTURE
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机译:焊点,焊点接合结构和形成焊点接合结构的方法
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摘要
A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.
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