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SEAL RING STRUCTURES WITH REDUCED MOISTURE-INDUCED RELIABILITY DEGRADATION

机译:密封圈结构减少了水分引起的可靠性退化

摘要

A semiconductor chip includes a seal ring adjacent to edges of the semiconductor chip; an opening extending from a top surface to a bottom surface of the seal ring, wherein the opening has a first end on an outer side of the seal ring and a second end on an inner side of the seal ring; and a moisture barrier having a sidewall parallel to a nearest side of the seal ring, wherein the moisture barrier is adjacent the seal ring and has a portion facing the opening.
机译:一种半导体芯片,其特征在于,在所述半导体芯片的边缘附近具有密封环。从密封环的顶表面延伸至底表面的开口,其中该开口具有在密封环的外侧的第一端和在密封环的内侧的第二端。防潮层具有与密封环的最近侧平行的侧壁,其中,防潮层与密封环相邻并且具有面对开口的部分。

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