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CHIP-TO-CHIP SIGNAL TRANSMISSION SYSTEM AND CHIP-TO-CHIP CAPACITIVE COUPLING TRANSMISSION CIRCUIT
CHIP-TO-CHIP SIGNAL TRANSMISSION SYSTEM AND CHIP-TO-CHIP CAPACITIVE COUPLING TRANSMISSION CIRCUIT
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机译:芯片到芯片的信号传输系统和芯片到芯片的电容耦合传输电路
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摘要
A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.
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